Recently, "Guzhouyu" released a flowchart for the domestic probe card industry in semiconductor CP testing, clearly presenting the entire chain from upstream raw materials (silicon wafers/chips, PCB substrates, space adapter substrates, etc.) to four major production stages (core probe manufacturing, substrate and PCB preparation, precision integration, quality inspection and calibration), and finally to finished product delivery.

The finished probe card boasts core advantages such as customization (with needle counts ranging from hundreds to 40,000 and a spacing of ≤45μm), ultra-large-scale parallel testing (with 256+ DUTs synchronized on a single card), micron-level precision (with coplanarity error ≤25μm), and a lifespan exceeding 1 million cycles, providing crucial support for the localization of semiconductor testing.
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