Empowering innovation with artificial intelligence

Guanglian Zhichuang Technology Co., Ltd

01. Core positioning: One-stop solution provider

Focusing on the field of semiconductor packaging and testing, we clearly identify ourselves as a Total Solution Provider, with our core competitiveness lying in our full-chain service capabilities. We concentrate on meeting the integrated testing needs of global semiconductor enterprises throughout the entire process. Our core value is to assist our customers in overcoming core challenges in chip testing and accelerating the product iteration and mass production processes.

02. Core service: full-chain packaging and testing support

Product matrix: covering core products such as probe cards, probes, probe stations, testers, and packaging and testing equipment; Service scope: providing full-chain services from product design, customized research and development to production delivery and technical support; Adaptability: achieving seamless service from wafer-level testing (CP), packaging-related services, to post-packaging testing (FT) throughout the entire packaging process; Customer value: simplifying supply chain management, reducing comprehensive costs, and enhancing testing efficiency and yield

03. Technical Advantages: Specialized Solutions for High-End MEMS Probes

Technological breakthrough: Breaking through the bottleneck of traditional probe technology, focusing on high-density, high-pin count, high-speed, and high-frequency application scenarios. Application coverage: Adapted to high-end fields such as mobile phone processors, high-performance computing (HPC), intelligent AI, automotive RF, and storage chips. Core advantages: Relying on independent research and development and strict quality control, we have significant advantages in test accuracy, stability, and service life, ensuring high-end chip performance verification.

04. Specialized solution capability for high-end MEMS probes

The technical barriers of high-end MEMS probes are concentrated in the deep integration of materials, structures, and processes. The core of the solution lies in breaking through performance bottlenecks through R&D capabilities and achieving full-dimensional customized adaptation. Promoting localization substitution and technological upgrading through continuous innovation provides core support for high-end manufacturing in the fields of semiconductors, automotive, medical, and industrial applications

05. Core technology research and development

Research and development and selection of high-performance material systems

Microstructure and functional design capability

High-frequency and high-speed signal optimization capability

Full lifecycle service capability

06. Core positioning

Through a systematic and structured presentation, the company's core product system is comprehensively displayed, providing an intuitive deconstruction of the core components and technical logic of the solutions.

Advantages of full-chain one-stop service

Advantage of full coverage of product system

Deeply cultivating advantages in vertical fields