Biwin Storage and Haiguang Chip have reached a strategic cooperation agreement, with a financial contribution of 200 million yuan to enhance AI optoelectronic interconnection packaging

On the evening of May 15th, Biwin Storage issued an announcement stating its intention to sign a strategic cooperation agreement with Beijing Haiguang Xinzheng Technology Co., Ltd. The agreement will focus on deep collaboration in the packaging business of optoelectronic interconnection products, and will simultaneously provide financial assistance of up to 200 million yuan to support the construction of AI computing power infrastructure and accelerate the collaborative development of the domestic silicon photonics industry chain.

According to the announcement, both parties will collaborate on the packaging of optoelectronic interconnection products, with Biwin Memory and its subsidiaries providing OEM services for Haiguang Chipzheng's optoelectronic interconnection products. Currently, core raw materials such as silicon photonic chips are in short supply and prices are high, resulting in a significant demand for funds for raw material procurement. Biwin Memory intends to provide a financial assistance of up to 200 million yuan with its own funds, specifically supporting Haiguang Chipzheng's raw material procurement. The maximum occupation period of this fund is 12 months, with the amount being recyclable and the interest rate not lower than the company's actual financing interest rate for the same period.

Biwin Storage is a leading domestic semiconductor storage and advanced packaging service provider, possessing mature wafer-level packaging technology and AI industry chain resources. This collaboration will leverage advanced packaging capabilities to tap into the core AI high-speed interconnect market, creating an integrated service platform for "storage, computing, and transportation." Haiguangxin, as a domestic one-stop solution provider for high-speed optoelectronic interconnects, specializes in silicon photonic chip design, high-speed optoelectronic devices, and optical module research, development, and production. Its products cover core AI data center scenarios and are innovative enterprises in the domestic silicon photonics field.